A device that dissipates heat from a component to the surrounding environment.
| Component | Heat Sink |
|---|---|
| Description | A device used to dissipate heat from electronic |
| components, such as transistors and integrated | |
| circuits, by increasing their surface area | |
| Features | - Improves thermal performance |
| - Easy to install | |
| - Reduces the risk of overheating | |
| - Increases the lifespan of electronic components | |
| Specifications | - Material: Aluminum or Copper |
| - Size: Varies based on application | |
| - Surface finish: Anodized or plated |
Heat Sink
- Product Code: Heat Sink
- Availability: 9
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7 LE